LIBRARY
2022 CPES Conference - Dialogue Session
Dialogue Session D1: Characterization, Packaging and Applications of WBG/UWBG Devices
D1.1: Overvoltage Ruggedness and Dynamic Breakdown Voltage of P-Gate GaN HEMTs in High-Frequency Switching up to Megahertz
Ruizhe Zhang, Qihao Song, Qiang Li, Yuhao Zhang
D1.2: Evaluation of 650V, 100A Direct-Drive GaN Power Switch for Electric Vehicle Powertrain Applications
Qihao Song, Joseph P. Kozak, Ming Xiao, Yunwei Ma, Boyan Wang, Ruizhe Zhang, Roman Volkov, Kurt Smith, Tamara Baksht, and Yuhao Zhang
D1.3: 10 kV, 39 mΩ·cm2 Multi-Channel AlGaN/GaN Schottky Barrier Diodes
Ming Xiao, Yunwei Ma, Kai Liu, Kai Cheng, Yuhao Zhang
D1.4: Thermo-Mechanical Analysis of a Custom Package for a (650 V, 150 A) e-GaN HEMT
Carl Nicholas, Shengchang Lu, Guo-Quan Lu
D1.5: Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials
Shengchang Lu, Zichen Zhang, Cyril Buttay, Khai D.T. Ngo, Guoquan Lu
D1.6: Characterization of a Nonlinear Resistive Polymer- Nanoparticle Composite Coating for Electric Field Reduction in a Medium-Voltage Power Module
Zichen Zhang, Shengchang Lu, Boyan Wang, Khai D.T. Ngo, and Guo-Quan Lu
D1.7: Effects of Underfill Properties on the Thermo-Mechanical Reliability of Double-Side Cooled (DSC) Power Modules
Filip Boshkovski, Guo-Quan Lu
D1.8: A PCB-Embedded 1.2 kV SiC Half-Bridge Module for EV On-Board Charger Applications
Jack Knoll, Gibong Son, Christina DiMarino, Qiang Li, Hannes Stahr, Mike Morianz
D1.9: A Novel Stray-inductance-based Current Sensor for Switching Current Measurement
Tam Nguyen, Slavko Mocevic, Keyao Sun, and Rolando Burgos
D1.10: High-Frequency Transformer and 1.7 kV Switching-Cells for an Integrated Power Electronics Building Block (iPEBB)
Narayanan Rajagopal, Ravisekhar Raju, Taha Moaz, Christina DiMarino
D1.11: High-Temperature Ultra-Wide Bandgap Gallium Oxide Power Module
Benjamin Albano, Boyan Wang, Dr. Christina DiMarino, Dr. Yuhao Zhang
D1.12: SiC-based Module Building Block with Integrated Coupled Inductor and Gate Driver
Jesi Miranda-Santos, Jack Knoll, Xingyu Chen, Christina DiMarino
D1.13: Development of 13 kV SiC MOSFET Wirebond-less Power Module
Danielle Lester, Mark Cairnie, Narayan Rajagopal, Christina DiMarino
D1.14: Thermal and Thermomechanical Analysis of a 10 kV SiC MOSFET Package with Double-Sided Cooling
Mark Cairnie, Christina DiMarino
D1.15: Static and Dynamic Characterization of a 10-kV SiC Phase Leg Module with Double-sided Cooling
Aishworya Roy, Mark Cairnie, Christina DiMarino
