LIBRARY
2023 CPES Conference
H1 - Characterization, Packaging, and Applications of WBG/UWBG Devices (Click to Expand)
H1.1: Design and Optimization of an Implanted-Trench Vertical GaN Superjunction
Matthew Porter, Yuhao Zhang
H1.2: Temperature and Radiation Tolerance of Multi-Channel GaN Diode for Aerospace Applications
Yijin Guo, Ming Xiao, Yuhao Zhang
H1.3: A Converter Based Switching Loss Measurement Method for WBG Device
Qiuzhe Yang, Ahmed Nabih, Qiang Li, Ruizhe Zhang, Yuhao Zhang
H1.4: Avalanche Capability in GaN Vertical PN Diode with Simple Edge Termination
Yifan Wang, Ming Xiao, Matthew Porter, Yuhao Zhang
H1.5: Gate Switching Robustness and Reliability of GaN P-Gate HEMTs
Bixuan Wang, Ruizhe Zhang, Qihao Song, Qiang Li, Yuhao Zhang
H1.6: 2.5 kV Vertical Ga2O3 Schottky Rectifier with Graded Junction Termination Extension
Boyan Wang, Ming Xiao, Yuan Qin, Joseph Spencer, Tadjer Marko, Yunwei Ma, Yuhao Zhang
H1.7: Considerations for Mitigating False Triggering of a Truly Differential Input Gate Driver for 1.2kV SiC MOSFETs
Jesi Miranda-Santos, Jack Knoll, Xingyu Chen, Christina DiMarino, Qiang Li
H1.8: A Guide for Accurate and Repeatable Measurement of the RTH,JC of SiC Packages
Jack Knoll, Christina DiMarino, Cyril Buttay
H1.9: 1.2 kV SiC MOSFET Full-Bridge Power Module with Integrated Gate Driver and Coupled Inductor
Jack Knoll, Jesi Miranda-Santos, Xingyu Chen, Christina DiMarino, Qiang Li
H1.10: Design And Fabrication Of An Inverter Module Co-Designed With Interfacing Busbar and Gate Driver
Aishworya Roy, Christina DiMarino, Che-Wei Chang, Jesi Miranda Santos
H1.11: Design and Fabrication of Gallium Oxide Junction Barrier Schottky Diode
Joseph A. Spencer, Boyan Wang, Ming Xiao, Kohei Sasaki, Akito Kuramata, Karl D. Hobart, Alan G. Jacobs, Travis J. Anderson, Marko J. Tadjer, Yuhao Zhang
H1.12: Electro-Thermal Device-Package Co-Design for Ultra-Wide Bandgap Gallium Oxide Power Devices
Benjamin Albano, Boyan Wang, Yuhao Zhang, Christina DiMarino
H1.13: Packaging of Double-Side Cooled SiC Power Module for 100 kW/Liter Traction Inverter
Qingrui Yuchi, Filip Boshkovski, Guo-Quan Lu
H1.14: Fabrication Refinements and Evaluation of a Wirebond-less Multi-Chip Power Module with 13 kV SiC MOSFETs
Danielle Lester, Mark Cairnie, Christina DiMarino
H1.15: Overvoltage Robustness of p-Gate GaN HEMTs in High Frequency Switching up to Megahertz
Ruizhe Zhang, Qihao Song, Qiang Li, Yuhao Zhang
H1.16: Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters
Filip Boshkovski, Carl Nicholas, Zichen Zhang, Khai D. T. Ngo, Guo-Quan Lu
H2 - EMI and Magnetics (Click to Expand)
H2.1: Design Comparison of Different Coupled Inductor Concepts for Voltage Regulators
Feiyang Zhu, Qiang Li
H2.2: Integrated Transformer for High Power Resonant Converters with SiC Devices
Tianlong Yuan, Feng Jin, Zheqing Li, Qiang Li
H2.3: Minimization of the Inter-winding Capacitance for Gate Driver Power Supply Applications
Satyajeet Deshmukh, Dong Dong, Rolando Burgos
H2.4: A Systematic Parasitic Capacitance Extraction Procedure for Three-Level Neutral-Point-Clamped Inverter Modules
Shin-Yu Chen, Ripun Phukan, Rolando Burgos, Dong Dong
H2.5: Electromagnetic Interference (EMI) Emissions in Modular Power Electronics Building Block (PEBB) based Medium-Voltage Power Converters Using 10 kV SiC MOSFETs
Ashkan Barzkar, Rolando Burgos, Dong Dong, He Song, Dushan Boroyevich
H2.6: Insulation Design for a Compact, Medium Voltage Transformer
Sharifa Sharfeldden, Ravisekhar N. Raju, Christina DiMarino
H2.7: Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module
Narayanan Rajagopal, Emre Gurpinar, Burak Ozpineci, Christina DiMarino
H2.8: Thermal modeling and cooling system design for PCB Winding
Yizhi Ruan
H2.9: Utilization of EMI Shielding in PCB Matrix Transformer for Inductor Integration for High Power Density Resonant Converter
Ahmed Nabih, Qiang Li
H3 - Resonant Converters (Click to Expand)
H3.1: A Planar Omnidirectional Wireless Power Transfer Platform for Portable Devices
Xipei Yu, Junjie Feng, Qiang Li
H3.2: An Isolated Constant-Current ZVS Class-E Inverter with Integrated Input Inductor
Bo Li, Khai Ngo
H3.3: A Single Phase CLLC Resonant Converter with a Novel Matrix Integrated Transformer
Feng Jin, Ahmed Nabih, Zheqing Li, Qiang Li
H3.4: Steady-State Analysis of a Multi-Phase DC-AC Quasi-Resonant Series-Capacitor Buck Converter
Aakash Kamalapur, Khai D.T. Ngo
H3.5: Design of a 24 V, 1 MHz, 5 kW Partial Power Processing Converter and High Frequency Transformer for 80 C Ambient Using Flex PCB Technology
Minh Ngo, Yuliang Cao, Dong Dong, Rolando Burgos, John Noon, Heath Kouns, Devin Durham
H3.6: High Current, High Power-Density 1.8V Bus Converter for Vertical Power Delivery to Next-generation SOCs
Pranav Raj Prakash, Ahmed Nabih, Qiang Li
H4 - High-Power Converters and Systems (Click to Expand)
H4.1: A Survey on Power Conversion Solutions for Hydrogen Production
Shivani H. Nair, Richard Zhang
H4.2: A Review on HVDC Circuit Breaker
Jiaxiong Yu, Richard Zhang
H4.3: Evaluation and Efficiency Comparison of Soft-Switching ARCP SiC-based Traction Inverters in Electric Vehicles
Che-Wei Chang, Matthias Spieler, Rolando Burgos, Dong Dong
H4.4: Transient Voltage Suppression (TVS) Diode-based Protection for 10 kV SiC MOSFET in 3 Phase 7-level 1.1 MVA, 13.8 kVac, 22 kVdc Multicell Power Converter
Arthur Mendes, Xiang Li, Boran Fan, Rolando Burgos
H4.5: Failure Modes and Effects Analysis (FMEA) of 10 kV SiC MOSFET-based 7-Level 13.8 kVac 22 kVdc Multicell Converter
Arthur Mendes, Xiang Li, Rolando Burgos
H4.6: Electric Field Constrained Design and Assembly for a 22 kV 5-Level and 7-Level Flying Capacitor Converters
David Nam, Joshua Stewart, Rolando Burgos
H4.7: A DC-Bus Planar Rogowski Coil Based Current Sensor for Half Bridge Applications
Matthias Spieler, Che-Wei Chang, Ayman El-Refaie, Muhammad H Alvi, Dong Dong, Rolando Burgos
H4.8: PCB Busbar Design and Verification for a Fully-integrated 250kW SiC Mosfet-based All-electric Aircraft Powertrain Converter
Junming Liang, Boran Fan, Rolando Burgos, Dong Dong
H4.9: Electronic MOV Based Voltage Clamping Circuit for DC Solid-State Circuit Breaker Applications
Lakshmi Ravi, Di Zhang, Dehao Qin, Zheyu Zhang, Yuntao Xu, and Dong Dong
H5 - Power Converter Modeling and Control (Click to Expand)
H5.1: Microgrid Building Blocks
Haris Bin Ashraf, Richard Zhang, Dushan Boroyevich, Chen-Ching Liu, Akshay Kumar Jain, Lung-An Lee
H5.2: 8-Phase Series-Capacitor Buck for 48-to-1.8 V Power Conversion in Data Centers
Xinmiao Xu
H5.3: Small-Signal Model of Multiphase Constant-On Time Control with Phase Overlapping
Sundaramoorthy Sridhar, Qiang Li
H5.4: Analysis on Closed Loop Control for GaN-Based CRM Totem-Pole PFC
Xingyu Chen, Gibong Son, Feng Jin, Qiang Li
H5.5: Partial Phase Overlap Control for 48V/1.8V Single Stage Series Capacitor Buck Converter
Adhistira M. Naradhipa, Qiang Li
H5.6: Fault Detection of Photovoltaics Panel using Impedance Measurement
Jeet Panchal, Bo Wen, Rolando Burgos
H5.7: A Grid-Supporting Rectifier with Frequency and Voltage Regulation Capabilities
Biqi Wang, Rolando Burgos, Bo Wen
H5.8: Loop Gain Modeling of a Single-Phase PFC for Online Small-Signal Stability Monitoring
Qing Lin, Bo Wen, Rolando Burgos
H5.9: Multi-Objective Co-Design Methodology for a High-Density, Medium-Voltage Integrated Power Electronics Building Block
Narayanan Rajagopal, Taha Moaz, Marie Lawson, Christina DiMarino, Dong Dong
H5.10: Phase Current Reconstruction, DC Link Voltage and Rds_on Measurement Using Sensors Integrated on Gate Drivers for SiC MOSFET
Vladimir Mitrovic, Boran Fan, Yuliang Cao, Rolando Burgos, Dushan Boroyevich
