RESEARCH
CPES Patent Information
US Patent: 11956914
Sealed Interface Power Module Housing
Christina DiMarino, Dushan Boroyevich, Rolando Burgos, Christopher Mark Johnson (University of Nottingham), Mark Carnie
Issued: April 09, 2024
Abstract:
A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.
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