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1.2 kV SiC MOSFET Full-Bridge Power Module with Integrated Gate Driver and Coupled Inductor

Year: 2023 | Author: Jack Knoll | Paper: H1.8
IMBB prototype
Fig.1. Trimetric view of the IMBB prototype.
  This work presents the hybrid direct-bond copper / printed circuit board (DBC/PCB) -based 1.2 kV silicon carbide (SiC) metal-oxide semiconductor field-effect transistor (MOSFET) full-bridge integrated module building block (IMBB) with integrated coupled inductor and gate-driver circuitry, as shown in Fig. 1. During the first step of the IMBB assembly procedure, the gate and source posts were sintered to the dies using nano-silver paste from NBE Tech. Second, the dies with newly attached posts -- plus additional posts connecting the PCB and DBC directly -- were sintered to the DBC using nano-silver paste from NBE Tech. Steps one and two were performed using the FineTech FINEPLACER pico ma multi-purpose manual die bonder. Third, the posts attached to the die and the opposite side of the posts connecting the PCB and DBC were soldered to the PCB using Sn96.3/Ag3.7 solder. Fourth, the module was underfilled. Finally, the gate-drive circuitry was soldered to the PCB using Sn63/Pb37.

  Static characterization performed on the IMBB after the full packaging procedure was completed indicates that all four dies in the full-bridge are functional. The IMBB has Ansys-Q3D-Extractor simulated power-loop and gate-loop inductances of 4.5 nH and 1.6 nH, respectively. Double-pulse tests (DPTs) were performed on the low-side and high-side MOSFETs of the IMBB. The resultant turn-off transient waveforms of the low-side MOSFET are seen in Fig. 2. During the DPTs, the low parasitic inductances of the IMBB allowed the bottom switch to achieve turn-off and turn-on dv/dts of 74 V/ns and 80 V/ns, respectively, with a 4% voltage overshoot. Silver-sintered MOSFET drains and the DBC substrate allow for measured junction-to-case and junction-to-ambient thermal resistances of 0.65 K/W and 1.18 K/W, respectively.

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