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Thermal modeling and cooling system design for PCB Winding

Year: 2023 | Author: Yizhi Ruan | Paper: H2.8
Hardware prototype picture
Fig.1. Enclosure of vapor chamber.
  The resonant converter is popular for DC/DC transformers due to its high efficiency, power density, and other capabilities. A planar transformer with printed circuit board (PCB) winding further pushes the power density limit of the resonant converter. However, heat dissipation of the PCB winding can be very challenging due to the use of materials with low thermal conductivity; however, active cooling can be an option for controlling the temperature of the prototype during lab experiments. The cost of energy and efficiency can be affected during standard operation. To improve the thermal performance and maintain the power density of the converter, thermal modeling is done. A phase-change cooling system is then designed. This paper demonstrates a high-efficiency, high-performance thermal and cooling system design for PCB windings. The paper is divided in three sections, Section I summarizes the investigation of requirements for thermal design. Section II gives some detail about thermal modeling and analysis. Section III demonstrates the prototype vapor chamber design and related experiments.
Thermal design
Fig.2. Thermal design and thermal impedance network.

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