Since 1998, Dr. Lu has worked extensively on research projects with colleagues in the Center for Power Electronics Systems (CPES). His research activities and interests are motivated by the needs for power electronics packaging and integration including materials for interconnect, insulation, magnetics, and substrate and assembly process technologies. He and his graduate students were early developers of three-dimensional, double-side cooled power electronics modules. In 2007, their development of nanoscale silver paste, nanoTach®, for low-temperature, pressure-less bonding of semiconductor chips was recognized with an R&D 100 award. These developments are being implemented in their research on packaging and integration of wide bandgap power devices for high-temperature and/or medium-voltage applications.
Dr. Lu is an IEEE fellow for his development of nanomaterials and packaging technologies in integration and manufacturing of power electronics modules.
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