RESEARCH
High Frequency 3D integrated POL Module Based on PCB Embedded Core
Year: 2013
Fig. 1. Low profile PCB integrated inductor substrate.
Fig. 1 and Fig. 2 show the PCB embedded inductor substrate and the PCB integrated POL module with a 20A output current. The improved flake material, SENFOLIAGE, is sandwiched into multi-layer PCB as the core. The silicon based NexFET power stage from TI is used to build the active circuit. The efficiency and the power density of the POL module are measured in Fig. 3. The PCB integrated module achieves almost the same power density as the LTCC integrated alternative, except that the cost is reduced and it's easier to fabricate with the low temperature process.
Fig. 2. 3D PCB integrated POL module.
Fig. 3. Measured efficiency and power density of the 3D PCB integrated POL module.
