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A Thermally-Enhanced High-Speed Switch Module: Fabrication and Application to Converters
Year: 2014
Fig. 1. Device temperature comparison between the PCB and proposed module.
A sample of the proposed module has verified that it suppresses the thermal resistance to 60% of that of its conventional printed circuit board (PCB) counterpart. The slopes of the blue and red curves in Fig. 1 indicate the thermal resistances of the proposed and conventional PCB. The proposed concept is applied to the 2-kW boost converter, of which a circuit diagram is shown in Fig. 2. Components in the dotted box in Fig. 2 are soldered on the DBC of the thermally enhanced module by a vacuum reflow process, as shown in Fig. 3(a), and the module is attached and wired by copper wires and ribbons, as shown in Fig. 3(b).
Fig. 2. 2-kW boost converter configuration. Components in the box are on the DBC of the thermally enhanced module.
Fig. 3. (a) The proposed thermally enhanced switching module.
Fig. 3. (b) Its attachment to PCB.
