EDUCATION
Power Electronics Packaging
Course Description
Power electronics packaging is advancing to meet rising demand in sectors like consumer electronics, electric transportation, data centers, and renewable energy. This course covers fundamental packaging concepts, cross-disciplinary principles, and finite element analysis (FEA) simulation.
Participants will learn theory and the latest research on electrical, thermal, materials, and reliability challenges, gaining insights into trade-offs and cutting-edge solutions. Topics covered include: die attach, interconnects, substrates, encapsulation, electrical and thermal characterization, and thermal and power cycling.
Engineers will be prepared to design effective packages for modern power electronics systems through hands-on experiments conducted in CPES’ world-class Packaging Laboratory. Participants will use ANSYS Electronics Desktop as well as the following instruments:
| • Wire Bonder | • Die Bonder | • Bond Tester (Shear and Pull) | • Profilometer |
| • Vacuum Over | • Curve Tracer | • Thermal Analyzer |
Travel to VTRCA
- Flying - Nearby airports include Washington Dulles International Airport (IAD) and Ronald Reagan Washington National Airport (DCA).
- Metro, Driving, and Parking instructions can be found at this link.
Contact
For any questions or registration instructions, please contact Nina Jaworski.
