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Design of On-Chip Microchannel Fluidic Cooling Structures
05/29/2007TYPE: PAPER - CONFERENCE
Authors: Huang, Z. R.; Zhao, M.
Source: ECTC 2007: Reno, Nevada (05/29/07)
Pages: 2017-2023
Copyright: © VPI&SU. All rights reserved. Permission is granted to CPES Industrial Partners to reproduce all or part of this material for their internal use only.
ABSTRACT
In this paper, we present five designs of microchannel fluidic cooling structures formed on a Si chip representing the heat source. The numerical simulation is performed by the software package of COMSOL Multiphysics, formerly FEMLAB. The fabrication process of the microchannel structure will also be discussed.
APPLICATION AREA(S):
- Point-of-Load Conversion
TECHNOLOGY AREA(S):
- High Density Integration
- Power Electronics Components
