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10 kV SiC MOSFET Power Module with Double-Sided Jet-Impingement Cooling

Year: 2023 | Author: Mark Cairnie | Paper: T2.4
Module with dimensions
Fig.1. Assembled 50A, 10kV SiC MOSFET package with double-sided jet-impingement cooling, measuring 65 x 51 x 22 mm3.
  Many years after the introduction of the first medium-voltage (MV) silicon-carbide (SiC) metal-oxide semiconductor field-effect transistors (MOSFETs), packaging technology remains a significant hurdle in the widespread adoption of SiC. Commercial packaging solutions, based on standard footprints, are constrained by stray inductance and thermal resistance, both of which limit the superior speed and power handling of MV SiC devices. To improve on existing standardized footprints, an innovative 10kV, 50A SiC MOSFET phase-leg package is proposed, which combines a lateral spring-pin terminal with wirebond-less molybdenum interconnects to enable <10 nH parasitic inductance and double-sided cooling. The module utilizes additively manufactured, direct jet-impingement coolers, integrated into the module housing to cool the four, third-generation 10kV SiC MOSFET dies. When compared to conventional cold plates, the integrated coolers allow for the removal of the baseplate and cold plate fixtures/clamps, while also alleviating certain insulation concerns.

  A combination of experimental measurements and analytical models were used to verify the thermal performance of the coolers and compare them to commercially available options. According to the experimental results, the integrated coolers in conjunction with the double-sided cooling can dissipate a heat load of 200 W/cm2 with an inlet temperature of 45° C, while maintaining a maximum junction temperature <160° C. The double-sided cooling provided a 30% decrease in effective θjc, from 0.253 K/W to 0.176 K/W per switch position, when compare to the equivalent single-sided cooled package. Pulsed switching tests were conducted at a bus voltage of 3 kV and a 60A load current, where the low stray inductance of the package enabled slew rates in excess of 150 V/ns. This module serves as a demonstration of the viability of double-sided cooling for improving the thermal performance of MV SiC devices without compromising electrical performance.

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