Effects of Soaking in Engine Coolant on Reliability of Some Joint Materials
Three kinds of low-temperature joining materials, such as 52In48Sn solder, TPF-100 thermoplastic film, DM4130B adhesive paste, were selected to bond DBA (Direct-bond aluminum) substrate onto the Heat Exchanger without the target plate. Chip-attached sandwich samples were fabricated for die-shearing test by mounting 3 3 mm ceramic dies on Al substrate with those joint materials, in order to evaluate the mechanical performance of the joint materials. All of those chip-attached samples were soaked in water-based coolant and air at 65°C. It can be seen that TPF-100 thermoplastic film and DM4130B gradually absorb the water-based coolant during soaking test except 52In48Sn solder joint with the soaking time. After the die-attached samples are soaked in air and water-based coolant at 65°C for 1000 hrs, of which the die-shearing strengths are measured. It is found that 52In48Sn solder and TPF-100 film are more reliable than DM4130B paste in the coolant and air soaking test. Compared the reliability of joint materials soaked in coolant with that in air, the coolant influences the die-shearing strength of DM4130B much more than that of 52In48Sn solder and TPF-100 film.