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Thermo-Mechanical Reliability Investigation of Large Temperature Excursions in Power Electronics Packages
Fig. 1. Conceptual drawing of cross-sectioned DBC samples, showing dimensions.
As seen in Fig. 2, the peak tensile peeling stress was verified by simulations and experiments as the major driving force of delamination. It is therefore the basis for improving the design and optimizing the process parameters so that power modules can have a high resistance to large temperature excursions.
Fig. 2. Comparison of peeling stress along the midline.
