LIBRARY
2025 CPES Conference - Technical Session
Technical Session 1: Power Devices and Packaging
1.1: Thermo-Mechanical Considerations for Large-Area, Thick-Copper Organic Substrates in an Integrated Power Electronics Building Block (PEBB)
Narayanan Rajagopal, Taha Moaz, and Christina DiMarino
1.2: Fast-response Gate Protection and Superior Gate Overvoltage Reliability Enabled by an IC Interface Monolithically integrated with GaN HEMT
Bixuan Wang, Qihao Song, Dong Dong, and Yuhao Zhang
1.3: Robust Avalanche (1.5 kV, 2 kA/cm2) in Vertical GaN Diodes on Patterned Sapphire Substrate
Yifan Wang, Ming Xiao, Zineng Yang, Matthew Porter, Kai Cheng, Qihao Song, Ivan Kravchenko, and Yuhao Zhang
1.4: Packaging of a Double-Side Cooled 3.3 kV, 100 A SiC MOSFET Phase-Leg Module
Li (Andrew) Zhang, Joshua Gardner, Zachary Zintak, Yancheng Chen, Juan Vascones Gomez, Qingrui Yuchi, Zichen Zhang, and Guo-Quan Lu
