An Ultra-Fast SiC Phase-Leg Module in Modified Hybrid Packaging Structure
This paper presents the development of an ultra-fast SiC phase-leg module built in modified hybrid structure. Because of the three-dimensional (3D) packaging technology, the hybrid structure achieves the same footprint and similar parasitics to the planar packaging, but requires no double-sided solderability on the bare dice, which is not available on current SiC devices. Compared to its previous generation, the modified hybrid structure also simplifies the fabrication significantly, and allows a much more complicated module design. A compact 1200 V, 10 A SiC MOSFET phase-leg module is designed and built in the proposed structure. Through proper layout design, ultra-low switching loop inductances can be realized, and experiments verify that the switching speed of the SiC MOSFET can be pushed to its very limit without excessive parasitic ringing.